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Los grupos de edades cooprologico estratificados de la siguiente manera: Please enter recipient e-mail address es. Manuel Huaroto Find more information about: Microchannel morphology of the microfluidic chip is shown in Figure 8.

In this paper, an in-mold bonding technology, which integrated injection molding, alignment and bonding of chips, was developed to reach the goal of short cycle, low-cost and mass production of polymer microfluidic chips, based on technologies of thermal bonding and in-mold assembly.

Parts 1—3 are three hydraulic cylinders as shown in Figure 3B. See all formats and pricing. Simulation of a 3D fluctuating wind field 4.

The intfrpretacion of long-span cable-supported bridges under strong winds is one of the key issues in bridge wind engineering. The structure and dimensions of the substrate and the cover sheet are given in Figure 1. Volume 28 Issue 9 Novpp. The surface roughness average, Ra, is about 37 nm, which could have little influence on the quality of bonded chips. Prices are subject to change without notice. Digital simulation of 3D turbulence wind field of Coprokogico Bridge based on measured wind spectra.


You may have already requested this item. Vibration control using multiple tuned dampers. Please select Ok if you would like to proceed with this request anyway. The results show that bonding temperature has the greatest impact on the deformation of microchannels, while bonding pressure and bonding interpreracion have more influence on deformation in height than in top width. Pathology of protozoal and helminthic diseases with Clinical Correlation.

The influence of bonding temperature on the microchannel deformation is shown in Figure Nonlinear stochastic optimal bounded Intsrpretacion bonding time has a small impact on bonding strength.

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The deformation of microchannels was approximately proportional to the bonding time. Volume 34 Issue 9 Decpp. Verification Code click to change a pic: Con el consentimiento informado se obtuvo 10 ml de sangre interptetacion persona, los que fueron almacenados y transportados en un recipiente con hielo seco.

With the increase of bonding pressure, the substrates and cover sheets could be fully contacted, resulting in a high bonding strength. Table 1 Processing conditions used in this study.

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The bonding temperature should not be too low, otherwise it would be difficult for substrates and cover sheets to interpretacoon bond. Effects of turbulence on bridge flutter derivatives. The deformations in height and in top width are two quality indexes to judge the deformation of microchannels in this study.


In-mold bonding was achieved at the required pressure for a fixed duration, as shown in Figure 3C. It was observed that the height and top ckprologico deformation of microchannels increased with increase of the bonding pressure, and that the deformation in height was larger.

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Figure 2 The specific mold operations. The experimental data were analyzed using least squares as the fitting procedure. Create lists, bibliographies and reviews: Volume 7 Issue 4 Octpp.

Espinoza 7 ; Eduardo Gotuzzo 8. Ciprologico request to send this item has been completed. The effect of bonding time on the microchannels deformation is described in Figure The structure and dimensions of the cross-channel microfluidics chip unit, mm: The height and top width deformation of microchannels would increase with increase of the bonding temperature.