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JIS Z 3197 PDF

JIS Z Test methods for soldering fluxes (Foreign Standard). Available for Subscriptions. Content Provider Japanese Industrial Standards [JIS]. JIS Z Test methods for soldering fluxes (Foreign Standard. JIS Z Halide content(mass %). ~ JIS Z Copper plate corrosion test. Passed. JIS Z Insulation resistance test( Ω).

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Aqua-soluble core flux was developed for used by assemblies’ manufacturer utilizing water-soluble wave soldering fluxes and aqua-soluble solder paste SME process The flux is thermally heat stable with minimal fumes and odor.

Post flux residues can be washed with lukewarm water O C.

CN101062536A – Non-halide cleaning-free welding flux for leadless solder – Google Patents

Brass and copper Brass and copper for consumer product. The residues left are near neutral pH and the core-flux can be utilized with an open torch flame or a soldering iron.

Low-splash and halogen-free welding agent for 31197 wires and preparation method thereof. Solder fillets can left 31977 to 24 hours and still remains shiny prior sending for post washing with water.

Fast and excellent instant wetting action used mainly by consumer products assemblies manufacturer. Low-rosin cleaning-free scaling powder for SnAgCu series lead-free soldering paste and preparation method thereof.


RM-5 (Flux for BGA / CSP Solder Ball)

Clear residue no-clean halide free flux used by assemblies’ manufacturer utilizing low solid no-clean wave soldering fluxes.

Halogen-free soldering agent for tin bismuth jiw unleaded tin paste and preparation method thereof.

The soldering flux does not have halogen, being environmental protective, good in welding, welding spot being full and luminous, without residue, no corrosion, high in isolation resistance. Environment his efficient water-based circuit board cleaning agent and preparation thereof. The said surface active agent is one or more of the nonion surface active agent, and the said organic amine and the derivant being ethanediamine, tetramethylenediamine, diethyl ethanolamine and so on, with the said film forming material being diethyl ethanolamine or resin.

TAMURA CORPORATION TLF Cleanable No-Clean Solder Paste |タムラ製作所

CN CNA en. A lead-free solder was washed with halogen-free flux, components of the flux by mass percentage: More than 90 SnPb More than 80 Sn A flux according jjs claim 1, wherein: Halogen-free low-splash solder wire and preparation method of halogen-free low-splash solder wire. A soldering flux as claimed in claim 5, characterized in that: Brass and copper for consumer product. Aqua-soluble core flux for used by assembly’s manufacturer utilizing water washing cleaning process.

Clear residue core flux for lead-free alloy cored solder wire was developed for minimal spitting, fast and excellent instant wetting action, ideally suitable for critical products assemblies manufacturer requiring.


The invention relates to a lead free soldering clean free soldering flux with the mass percentage of organic acid activating agent 1. Halogen-free lead-free 319 paste for radiator and preparation method thereof. The said organic acid could be one or more of the aliphatic acid mono acid or bi-acid, aromatic acid, or amino acid.

MATSUTA 旺興達有限公司

Flux for soldering electronic components on circuit substrates, and mounted or unmounted circuit substrate. This flux is a high activity, heat stable with minimal fumes and odor. The flux according to claim 1, wherein: Colophony type non-halide cleaning-free soldering flux for lead-free solder wire.

More than 90 SnPb. The residua can be completely removed with luke-warm simple water rinse.

The film-forming substance in the raw material, i. CN CNA en Water – soluble x flux. Aqueous cleaning soldering flux for lead-free soldering and preparation method thereof. Preparation and use of the same method as in Example 1. Ideally used mainly by consumer products assemblies’.